China successfully developed the LED interior lighting package technology with MCOB

January 31, held in Putian, Fujian Academy "LED high bay light with low cost and high efficiency improved MCOB packaging materials and technology integration" achievements appraisal meeting, expert appraisal committee agreed that the technology has a complete independent intellectual property rights and has achieved large-scale industrialization, product technical indicators have reached the international advanced level.

The group agreed that, after long-term basic research and engineering application research, the results of key materials through packaging design and development, the formation of new materials based on improved multi-functional, multi-cup, multi-chip (MCOB) package of innovative integration technology, significantly improve the light efficiency, effectively reducing the cost of key materials and made major breakthroughs in key technologies with independent intellectual property rights, and has achieved scale industrialization.

Since 2009, the Chinese Academy FIRSM Optoelectronics Technology Co., Ltd. and Fujian IMC co-launched the MCOB packaging materials and structures industrial manufacturing technology research and development, and now, it developed a light efficiency lighting products have reached the international advanced level, while the price is only 30% of the market similar products. 2012, the use of this technology has achieved an annual output of 1.5 million LED bulb and one million LED fluorescent strip.

The Group believes that this results from the packaging material to form a package structure are complete independent intellectual property rights, including four innovative technologies:

First, the design and development of a multi-functional high-reflectance optical ceramic thin aluminum plates, as MCOB package substrate materials, there are usually resolved silver film yellowing problem, breaking the thermal insulation barrier, improve the substrate reflectivity and light luminous efficiency, simplifying the packaging structure, lamps reduce the total cost more than a quarter. Application of the substrate MCOB package technology enables LED bulb whole lighting effect 153.37Lm / W, color rendering index of 82.8, LED fluorescent strip the whole lighting effect 154.72Lm / W, color rendering index of 70.2.

Second, the first to use cast molding process developed composite laminated composite alumina ceramic substrate, to achieve a high diffuse reflectance and high thermal conductivity, high resistance to electrical breakdown resistance, high reliability, performance and other advantages of the combination, effectively improve the efficiency of the light source and optical quality, to solve the ordinary alumina ceramic substrate, a low reflection, low heat conductivity problems. The application of the composite ceramic substrate MCOB package technology to achieve the LED high bay light whole lighting effect 149.97Lm / W, color rendering index of 82.5, LED fluorescent strip the whole lighting effect 141.2Lm / W, color rendering index of 69.8.

Third, through innovative technology and crystal field modulation techniques, preparation of starting wavelength tunable, no surface defects, high quantum efficiency, low light decay, close to the theoretical value of the transmittance of a new generation of fluorescent material - transparent ceramic garnet-type structure phosphor using this new transparent ceramic phosphors MCOB package, significantly improve the light reliability and efficiency, simplifying the assembly structure, reducing costs, solving the normally present phosphor and packaging adhesive caused by the aging of the color drift and light decay problems. Meanwhile, the first proposed and used a double-sided light package structure at low current drive to achieve a multi-chip package structure light source efficiency 261Lm / W.

Fourth, the adoption of improved MCOB technology integration (including the above three kinds of substrate and chip packaging technology post-processing technology, power technology, ceramic cooling fins technology, high thermal underfill technology, etc.) form a low-cost, high-efficiency LED light source and lighting technology package , LED products, lower costs more than a quarter, 50% efficiency, performance indicators international leader.

The Group recommends that need further accelerate technology popularization and application, especially transparent fluorescent ceramic technology industry applications, and expand the industrial scale, to enhance China's LED lighting industry's core competitiveness.

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