Analysis of China LED package device industry development trend

(A) flip-chip type LED chip package

In addition to the vertical chip type flip-chip is the industry's highly development. led street light Manufacturer three-dimensional chip production much simpler than that, and can avoid the complexity out process, making mass production feasibility dramatically, with the back-end chip technology and through-hole technology is mature finger assisted in the past have grown more stars Golden Globe solid crystal way into a large area of P, N electrodes directly mount bracket, with the eutectic solid crystal way, will greatly simplify the technical threshold type flip-chip package. Furthermore, the package thermal path shorter, horizontal compared to chip has better cooling capacity, the drive voltage can also be reduced in the future carbon reduction drive, the flip-chip package type would be a good solution.

Based on the above packaging considerations, the main techniques currently used for encapsulating the phosphor coating and turn injection process. Fluorescence is a billion light coating technology development, mainly covering a thin layer of phosphor layer on the chip, so can significantly enhance the luminous efficiency of components, this product is currently billion light has been used in the high-power components.

Technology transfer note is the use of the original in a small surface-mount type products above was a great success, and further use of this technology in the high-power models, to overcome the technical problems with sticky silicone molding die, at present, due to the TV and other backlight assembly of power lifting and reliability requirements, the traditional reflection PPA cover substrate is an organic material, such as silicon or resin can not provide a better ability to heat and light, in order to effectively improve the reliability, plans to use this technology transfer note in backlighting assembly.

On package size, the current can reach the minimum high power package dimensions 3.0 × 3.0mm, or even sample preparation 2.0 × 2.0mm or less, but the current specification is still the most common commercially available 3.5 × 3.5mm product, this extremely broad application of surface products, so as to open Everlight pioneer era of molecular solid-state lighting, Everlight will continue on this product will be applied to the small size and high-power technology to low-cost aluminum nitride ceramic substrate with high reflectivity mirrors fabricate products for the packaging of this bracket, the other co-payment will apply solid crystal technology, with metal fast heat from the LED heart-oriented high thermal conductivity of aluminum nitride ceramics, in order to reduce LED component operating temperatures reach high efficiency (150lm / w), high power (3-5W operation), long life (60000hrs), low-power LED product performance.

The chip select and high quality partners around the world working together to improve the quality and reduce the cost of existing chips, as well as the rapid development of a new chip architecture, with a view to the lowest cost mass production of silicone die technology, reduce existing LED chip package cost technology and optical design and rapid response in line to take the light effects of the new chip architecture designed with a view to achieve mass production of lowest cost, most efficient design goals.

(B) 20W LED package above

In terms of LED packaging, COB packaging technology is another major focus, 10W LED NA following COB packaging technology, this area is still using a single powerful package on mainstream; 20W LED above are more suitable for COB packaging technology. Currently, Japan LED bulb market is mainly converted to polycrystalline COB package focuses mainly on high-power chips and modules are used mostly for MR16 LED light source, such as directional.

Currently with more than COB packaging is aluminum plate, copper substrate and ceramic substrates. The thermal conductivity of each material is different, resulting in differences in their thermal properties, such as thermal conductivity of diamond is 1000, followed by silver and copper is about 400, and then aluminum is more than 100, and between the thermal conductivity of the ceramic 8-22. In the insulating material, the thermal conductivity of ceramic is considered good, with cheap, so many package options ceramic substrates.

(C) high-voltage LED package

In addition to high-power LED, the high-voltage LED package is also a major focus. High voltage LED package products across the 1W, 2W and 4W product market, and the advent of high-voltage products, is a whole new way of thinking to solve the solid-state lighting due to the presence of step-down circuit caused by excess energy depletion problem, and thus help end consumer by reducing purchasing costs. Meanwhile, due to the high pressure of the LED chip itself with the sapphire substrate, the lateral light than the average chip for strong, so the whole point of using a phosphor coated evenly in the package should be designed, in full view in order to package the color temperature consistency, and thus enhance the light quality.

High voltage led high bay light for sale packaging technology focuses continuation above advantages, in addition should also provide consumers with more convenience, such that different areas at different voltage operating conditions, can get quick and easy application. For example Everlight 4W product launch, direct access to a series-parallel circuit board design to meet the global 110V and 220V voltage source different needs. And because the voltage across the voltage single component of the package, up to 110V worse 220V, and therefore in the development of high-voltage LED packaging, Everlight stick with insulating ceramic substrate in the form of the package, in order to reduce the small size between positive and negative electrodes of a spark discharge dangerous.